lm1458 , lm1558 www.ti.com snosbu4d ? april 1998 ? revised march 2013 lm1458/lm1558 dual operational amplifier check for samples: lm1458 , lm1558 1 features 2 ? no frequency compensation required ? low-power consumption ? short-circuit protection ? 8-lead to-99 and 8-lead pdip ? wide common-mode and differential voltage ? no latch up when input common mode ranges range is exceeded description the lm1458 and the lm1558 are general purpose dual operational amplifiers. the two amplifiers share a common bias network and power supply leads. otherwise, their operation is completely independent. the lm1458 is identical to the lm1558 except that the lm1458 has its specifications guaranteed over the temperature range from 0 c to +70 c instead of ? 55 c to +125 c. connection diagram figure 1. to-99 package figure 2. dual-in-line package (top view) (top view) see package number lmc (o-mbcy-w8) see package number d (r-pdso-g8) or p (r-pdip-t8) these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 1998 ? 2013, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
lm1458 , lm1558 snosbu4d ? april 1998 ? revised march 2013 www.ti.com absolute maximum ratings (1) (2) (3) supply voltage lm1558 22v lm1458 18v power dissipation (4) LM1558H/lm1458h 500 mw lm1458n 400 mw differential input voltage 30v input voltage (5) 15v output short-circuit duration continuous operating temperature range lm1558 ? 55 c to +125 c lm1458 0 c to +70 c storage temperature range ? 65 c to +150 c lead temperature (soldering, 10 sec.) 260 c soldering information pdip package soldering (10 seconds) 260 c soic package vapor phase (60 seconds) 215 c infrared (15 seconds) 220 c see an-450 ? surface mounting methods and their effect on product reliability ? for other methods of soldering surface mount devices. esd tolerance (6) 300v (1) ? absolute maximum ratings ? indicate limits beyond which damage to the device may occur. operating ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. (2) refer to rets 1558v for lm1558j and LM1558H military specifications. (3) if military/aerospace specified devices are required, please contact the ti sales office/distributors for availability and specifications. (4) the maximum junction temperature of the lm1558 is 150 c, while that of the lm1458 is 100 c. for operating at elevated temperatures, devices in the lmc package must be derated based on a thermal resistance of 150 c/w, junction to ambient or 20 c/w, junction to case. for the pdip the device must be derated based on a thermal resistance of 187 c/w, junction to ambient. (5) for supply voltages less than 15v, the absolute maximum input voltage is equal to the supply voltage. (6) human body model, 1.5 k in series with 100 pf. electrical characteristics (1) parameter conditions lm1558 lm1458 units min typ max min typ max input offset voltage t a = 25 c, r s 10 k 1.0 5.0 1.0 6.0 mv input offset current t a = 25 c 80 200 80 200 na input bias current t a = 25 c 200 500 200 500 na input resistance t a = 25 c 0.3 1.0 0.3 1.0 m supply current both t a = 25 c, v s = 15v 3.0 5.0 3.0 5.6 ma amplifiers large signal voltage gain t a = 25 c, v s = 15v 50 160 20 160 v/mv v out = 10v, r l 2 k input offset voltage r s 10 k 6.0 7.5 mv input offset current 500 300 na input bias current 1.5 0.8 a large signal voltage gain v s = 15v, v out = 10v 25 15 v/mv r l k output voltage swing v s = 15v, r l = 10 k 12 14 12 14 v r l = 2 k 10 13 10 13 v (1) these specifications apply for v s = 15v and ? 55 c t a 125 c, unless otherwise specified. with the lm1458, however, all specifications are limited to 0 c t a 70 c and v s = 15v. 2 submit documentation feedback copyright ? 1998 ? 2013, texas instruments incorporated product folder links: lm1458 lm1558
lm1458 , lm1558 www.ti.com snosbu4d ? april 1998 ? revised march 2013 electrical characteristics (1) (continued) parameter conditions lm1558 lm1458 units min typ max min typ max input voltage range v s = 15v 12 12 v common mode r s 10 k 70 90 70 90 db rejection ratio supply voltage r s 10 k 77 96 77 96 db rejection ratio schematic diagram numbers in parentheses are pin numbers for amplifier b. copyright ? 1998 ? 2013, texas instruments incorporated submit documentation feedback 3 product folder links: lm1458 lm1558
lm1458 , lm1558 snosbu4d ? april 1998 ? revised march 2013 www.ti.com revision history changes from revision c (march 2013) to revision d page ? changed layout of national data sheet to ti format ............................................................................................................ 3 4 submit documentation feedback copyright ? 1998 ? 2013, texas instruments incorporated product folder links: lm1458 lm1558
package option addendum www.ti.com 26-jul-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lm1458 mwc active wafersale ys 0 1 green (rohs & no sb/br) call ti level-1-na-unlim -40 to 85 lm1458m nrnd soic d 8 95 tbd call ti call ti 0 to 70 lm 1458m lm1458m/nopb active soic d 8 95 green (rohs & no sb/br) cu sn level-1-260c-unlim 0 to 70 lm 1458m lm1458mx nrnd soic d 8 2500 tbd call ti call ti 0 to 70 lm 1458m lm1458mx/nopb active soic d 8 2500 green (rohs & no sb/br) cu sn level-1-260c-unlim 0 to 70 lm 1458m lm1458n/nopb active pdip p 8 40 green (rohs & no sb/br) cu sn level-1-na-unlim 0 to 70 lm1458n LM1558H active to-99 lmc 8 500 tbd call ti call ti -55 to 125 ( LM1558H ~ LM1558H) LM1558H/nopb active to-99 lmc 8 500 green (rohs & no sb/br) call ti level-1-na-unlim -55 to 125 ( LM1558H ~ LM1558H) mc1458cp1 obsolete pdip p 8 tbd call ti call ti 0 to 70 lm1458n mc1458p1 obsolete pdip p 8 tbd call ti call ti 0 to 70 lm1458n mc1558g active to-99 lmc 8 500 tbd call ti call ti -55 to 125 ( LM1558H ~ LM1558H) (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above.
package option addendum www.ti.com 26-jul-2016 addendum-page 2 green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant lm1458mx soic d 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 q1 lm1458mx/nopb soic d 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 q1 package materials information www.ti.com 11-oct-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) lm1458mx soic d 8 2500 367.0 367.0 35.0 lm1458mx/nopb soic d 8 2500 367.0 367.0 35.0 package materials information www.ti.com 11-oct-2013 pack materials-page 2
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